RTP System uses microwave heating

RTP System uses microwave heating

Microelectronics Journal, Vol. 24, No. 1/2 Optical lithographic techniques for 256 Mbit DRAM technology are also being explored by others including r...

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Microelectronics Journal, Vol. 24, No. 1/2

Optical lithographic techniques for 256 Mbit DRAM technology are also being explored by others including rival Japanese firm Toshiba which is collaborating with Siemens of Germany and IBM of the US in this technology. Three lithographic processes are being investigated by the alliance: i-line steppers, excimer lasers and Micrascan.

RTP System Uses Microwave Heating The Swedish Institute for Microelectronics has developed a microwave-heated rapid thermal processing (RTP) system, which it claims can perform CVD and etching as well as general-purpose heating for dopant activation, silicide formation and curing of spin-on-glass, photoresist and polyimide. First commercial versions of the system (the Vacutec 1550 MRTP) have been developed in co-operation with the Swedish company Vacutec. In single wafer reactors, the traditional heating method is to use tungsten-halogen incandescent lamps. However, microwave heating achieves the same results and offers some other advantages.

INTEL P6 Available in 18 Months While lntel is suspected of having problems with first samples of its P5 microprocessor and struggling to get it into the commercial market-place, the US company is already talking about its successor, the P6. According to the company, the P6 will be available in about 18 months time.

Motorola Reveals 68060 Technical Details Motorola's Microprocessor and Memories Technology Group has disclosed technical details of the next generation 68000 family processor, the 68060. The MC68060 will be a superscalar, high-performance, 32-bit microprocessor providing a low-power mode of operation, h will be fully compatible with all previous members of the M68000 family, and will feature dual on-chip caches, fully independent demand-paged memory management units for both instructions and data, dual integer execution pipelines, on-chip floating-point unit, and a branch target cache. The MC68060 will be implemented with more than two million transistors in 0.5 ~tm triple-layer metal technology. The initial product will be in production in the first half of 1994, and will have greater than three times the performance of today's 25 MHz 68040, based on existing compilers. New compilers will increase this performance further. The MC68060 will be available as 50 MHz and 66 MHz versions, with 3.3 V supply voltage, and in ceramic PGA and CQFP packaging configurations.

Hitachi HEMT provides boost for DBS Hitachi has expanded its range of HEMT LNAs for use in DBS converters. The new 2SK1977 GaAs HEMT has an ultra-low noise level of 0.55 dB and has a high power gain of 11.5 dB (at 12 Gttz). This enables the most efficient conversion and amplification of the received signal from the SHF band to the UHF band, Hitachi says. This release brings Hitachi's range of 12 GHz products to six.

The device will be Intel's most advanced microprocessor, containing more than ten million transistors compared with the P5 which will have 3.1 million transistors. Full details of the P6 have not yet been released but it is expected to include several co-processors and multimedia technologies on the same chip.

Contact: Vince Pitt, Hitachi Europe, tel~fax: [44] (0)628 585000 / 585200.